Difference: Rich1UpgradeMechanicsServices (2 vs. 3)

Revision 32015-02-25 - MichaelMcCann

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META TOPICPARENT name="Rich1UpgradeMechanics"

RICH 1 Upgrade Services

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 Mostly taken from a talk at the infrastructure workshop. but based on a plane of 11 columns, a column of 6 modules, and a module of 2 DB and 4 ECs.

Data

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Each DB requires a fibre per GBT, there are two GBTs per FPGA, and 3 FPGAs per board. Each DB is coupled to a harness board which merge fibres into ribbons. Each ribbon will remain as a bundle all the way to the TELL40s, so should only contain data. It is envisioned that a 12 fibre ribbon can cover two digital boards, and hence a single module. Patch pannel connectors like one of these http://www.usconec.com/products/mtp_adaptors.htm, probably.
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Each DB requires a fibre per GBT, there are two GBTs per FPGA, and 3 FPGAs per board. Each DB is coupled to a harness board which merge fibres into ribbons. Each ribbon will remain as a bundle all the way to the TELL40s, so should only contain data. It is envisioned that a 12 fibre ribbon can cover two digital boards, and hence a single module. Patch panel connectors like one of these http://www.usconec.com/products/mtp_adaptors.htm, probably.
 

ECS

Each DB requres a transmission and receiver fibre coupled through a GBT to the SCA. It is envisioned that a 12 fibre ribbon will serve multiple boards. The ribbons will go all the way to a SOL40, presumably there are no PCIe40s configured for data, ECS, and TFC. Same patch panel connectors as Data.
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 LV shared across a column. 8.5 Amps per DB, so 100 A per column, probably at 2.5/5 V? quick back of envelope calc says conductors ~ 7mm diameter (20 m ~ 1V drop). Need, both positive and ground connections.

High Voltage

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1.1kV, mostly common to a module, some split powering in high occupancy regions (a 4 by 4 module region) of the last, and maybe last but one dynode. Maybe some SHV connector like [http://www.alliedelec.com/1/products/106825-0-187-gold-solder-nickel-shv-connector.html], since it's only 1kV? Arrives at the detector as several 56 conductor cables 04.31.52.100.5(cern stores), needs to get to the harness as 1 or 2 or 3 SHVs?. Common ground on a column (or to several modules), so patch panel isn't straight through. Will need a patch panel to cover the plane/several columns rather than per column.
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1.1kV, mostly common to a module, some split powering in high occupancy regions (a 4 by 4 module region) of the last, and maybe last but one dynode. Maybe some SHV connector like http://www.alliedelec.com/1/products/106825-0-187-gold-solder-nickel-shv-connector.html, since it's only 1kV? Arrives at the detector as several 56 conductor cables 04.31.52.100.5(cern stores), needs to get to the harness as 1 or 2 or 3 SHVs?. Common ground on a column (or to several modules), so patch panel isn't straight through. Will need a patch panel to cover the plane/several columns rather than per column.
 

Cooling

Externally, same as now, two loops (one for the up box, one for down box), but beefed up a bit. Internally a cooling bar, with coolant tubes built in. between the two there has to be some manifold, as daisy chaining is probably a bit too much, but the specifics is all provisional.
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Calibration

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Proably going to have some fibres to inject a laser, 1 x 12 MPO per box like we currently have?
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Probably going to have some fibres to inject a laser, 1 x 12 MPO per box like we currently have?
 

Spares

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  patch.png
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For the HV: Assume split poweing of last and second to last dynode + 2 spare channels = 100 so 10x10 SHV array (internal). The inside is the setting the limits, the 56 conductor cables. SHV connector ~ 15mm + 10 mm finger room -> 260mmx260mm patch panel. Would need t be quite thick though.
 
META FILEATTACHMENT attachment="patch.png" attr="" comment="" date="1424804273" name="patch.png" path="patch.png" size="18474" user="mmccann" version="1"
 
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