Beam Telescope and Test Beam Workshop

Abstracts

Data-taking experience with the CLICdp Timepix3 telescope

• Speaker: Andreas Nürnberg (CERN)
• Status: Submitted
• Abstract: The vertex- and tracking detectors at the proposed high-energy CLIC electron-positron collider will be based on small-pitch silicon pixel- or strip detectors. The requirements for these detectors include single-point position resolutions of a few microns and time stamping with an accuracy of approximately 10 ns. Tests with particle beams are needed to assess the performance of existing and future prototype assemblies. To this end a high-resolution beam telescope based on Timepix3 hybrid pixel-detector assemblies with data-driven readout has been constructed and successfully commissioned in the H6 beam line of the CERN SPS. It allows for track reconstruction at high particle rates (data driven readout with up to 10 million tracks / second) and with excellent spatial (~2 microns) and temporal (~1 ns) resolution. The readout system follows the LHCb Timepix3 telescope architecture based on SPIDR boards and Xilinx Virtex-7 FPGAs. Several pixel detector prototypes with different readout architectures have been integrated into the telescope DAQ system and operated with high-energy hadron beams. The EUTelescope software framework is used for the reconstruction and data analysis. We present performance results for the telescope, discuss the event building and reconstruction methods for various devices under test and show examples of ongoing data analyses.
• Slides

Preliminary test beam results of SOI monolithic pixel detectors

• Speaker: Roma Dasgupta (AGH University of Science and Technology, Cracow)
• Abstract: In the Silicon-On-Insulator CMOS structure the insulator layer is implemented between the handle wafer and the epitaxial silicon layer, which enables the design of a monolithic pixe detector without the need for bump-bonding. Due to the reduced detector volume there is much less particle scattering which results in a better spatial resolution. This is a significant advantage for vertex and tracking detectors at future linear colliders where high precision detectors are needed. In this contribution preliminary test beam results of a SOI pixel detector designed by the AGH-UST and IFJ PAN groups in Cracow and fabricated in Lapis 0.2 um SOI CMOS technology are presented. The tested detector is produced on 500 um thick high resistivity floating zone wafer. The pixel architecture is based on source-follower and its size is 30x30 um. The test beam data was recorded in the 120 GeV pion beam at the SPS H6 beamline at CERN in collaboration with the CLICdp collaboration in June-August 2016. The data was analysed in order to compute the spatial resolution of the detector. The analysis procedure includes pedestal and noise calculation, correlation with the Timepix3 reference telescope, different cluster reconstruction algorithms, as well as alignment and eta correction. Preliminary results give a spatial resolution of about 4 um in both X and Y directions. The results are presented for different back bias voltages.
• Slides