Corryvreckan reconstruction software

  • Speaker: Jens Kroeger (CERN)
  • Status: Accepted
  • Abstract: Corryvreckan is a modular test beam data reconstruction and analysis framework developed within the CLICdp collaboration. Its modular structure allows for a separation between the framework core and the implementation of the algorithms in each module. This allows users to ‘plug-in’ the wanted modules and configure their parameters easily from one configuration file. The software is written in modern C++, following the C++11 and C++14 standards and has a continually updated extensive user manual. Notable features of Corryvreckan are the 4D tracking capabilities, the online monitoring module useful for checking data quality during data taking, and the ability to use different combinations of triggered and trigger-less devices. In this talk, the software framework will be outlined, details of the module capabilities are discussed, and improvements since BTTB7 are summarized. In particular, the highly flexible event building logic is explained and supplemented by example use cases based on recent data-taking campaigns at the DESY test beam facility. In conjunction with this talk there will be a 2.5 hours ‘hands-on’ tutorial on Corryvreckan during BTTB8, repeated twice.
  • Slides

Silicon Pixel Detector Test-beam Studies for the CLIC Tracking System

  • Speaker: Magdalena Munker (CERN)
  • Status: Accepted
  • Abstract: Challenging requirements are imposed on the vertex and tracking system of the detector for the proposed future Compact Linear Collider CLIC. A temporal resolution of a few nanoseconds and a spatial resolution of a few m need to be achieved simultaneously with a material budget of down to less than one percent per detection layer. Various silicon pixel detector technologies are under investigation in a broad technology R&D programme. CLICpix2, a 65 nm CMOS chip with a pixel pitch of 25 μm, has been designed to fulfil the requirements of the CLIC vertex detector. Hybrid assemblies with CLICpix2 chips bump-bonded to thin planar active edge sensors have been produced and characterised in beam tests. The large collection electrode ATLASpix monolithic CMOS chip with a pixel size of 40 μm x 130 μm has been produced in a 180 nm High-Voltage CMOS process and is under study for the CLIC tracker. Moreover, a small collection-electrode monolithic CMOS chip with a pixel size of 30 μm x 300 μm, the CLICTD, has been developed for the CLIC tracker. This novel chip design with sub-pixel segmentation of the analogue frontend is implemented in two variants of a modified 180 nm CMOS imaging process, optimised for fast collection and high spatial resolution. These different detector prototypes are tested using the 6 GeV electron beam at DESY and a EUDET-type reference telescope with the EUDAQ2 DAQ framework. A Timepix3 plane has been integrated in the telescope setup, allowing for a track-time reference of ~1 ns. The different Devices Under Test are read out by the Caribou DAQ system, a versatile data acquisition system based on a System-On-Chip FPGA architecture. Details of the test-beam data-taking setup as well as analysis results will be presented in this talk.
  • Slides
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PDFpdf BTTB8_Kroeger.pdf r1 manage 12841.9 K 2020-02-05 - 10:33 EmiliaLeogrande  
PDFpdf BTTB8_Munker.pdf r1 manage 39841.4 K 2020-02-05 - 10:32 EmiliaLeogrande  
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