ECFA LC 2016

CLICdp status

• Speaker: Ignacio Garcia Garcia (Instituto de Fisica Corpuscular)
• Status: invited talk
• Abstract: not needed
• Slides

Engineering developments for the CLIC tracking system

• Speaker: Fernando Duarte Ramos (CERN)
• Status: submitted
• Proposed duration: 20 min
• Abstract: The CLIC detector tracking system is currently composed of a vertex detector with three double-sided layers of silicon detectors on both the barrel and forward regions and a silicon tracker consisting of six barrel layers and four/seven endcap disks on the outer/inner tracker subsystems, respectively. The strict requirements in terms of material budget (2 x 0.2% X0 per vertex double layer and 1% X0 per tracker layer) require the development of novel low-mass support structures and non-conventional cooling solutions. This talk will present the layout and support structures concepts that are currently being explored for the tracker as well as first results from finite element simulations and small scale prototypes. In addition, the developments on the prototyping of vertex detector staves for thermal studies will also be reported.
• Slides

Recent ASIC developments for the CLIC vertex detector

• Speaker: Daniel Hynds (CERN)
• Abstract: As part of the R&D towards the CLIC vertex detector, many different technologies are being investigated. The current expectation is for a hybrid pixel detector, with the readout ASIC either bump-bonded to slim-edge planar silicon sensors or glued to “active" HV-CMOS sensors. The first generation of capacitively coupled assemblies for CLIC were tested extensively during 2015, and served as input to the design of new devices, created specifically to meet the vertex detector requirements. An overview of the measurements leading up to their design will be presented, along with the final design of both the readout ASIC (CLICpix2) and the HV-CMOS sensor (C3PD). Parallel developments on power-pulsing of the electronics, crucial to achieve the low power budget required at CLIC, will also be presented.
• Slides

CLIC vertex and tracker sensor studies

• Speaker: Andreas Nurnberg (CERN)
• Abstract: The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. A single-point resolution of 3 um in the vertex detector and 7 um in the tracker and time slicing at the level of approximately 10 ns have to be achieved. All-silicon vertex and tracking systems meeting these requirements are currently under development. Both hybrid concepts and fully integrated sensors are under consideration. In this talk, test beam studies of planar silicon sensors read out by Timepix3 and CLICpix ASICs are presented. In order to improve the detection efficiency close to the physical edge of the sensor, some of the investigated devices are fabricated with an implanted cut edge (active edge). The experimental results for different edge implementations are compared to T-CAD device simulations. Additionally, in view of a monolithic design for the CLIC tracker, first test beam measurements performed on a small analog CMOS demonstrator pixel chip are be presented.
• Slides

Direct and indirect BSM searches at sqrt(s) > 500 GeV

• Speaker: Philipp Roloff (CERN)
• Slides

CLICdp simulation model

• Speaker: Marko Petric (CERN)
• Slides

CLIC Pattern Recognition and Tracking

• Speaker: Daniel Hynds (CERN)
• Slides