For all work with the clicpix + hv-cmos assemblies, care should be taken not to turn on the FPGA board directly after turning it off. Doing so will cause the chip to burn like an LED and self-destruct. This is not a joke.
To set up the system from scratch, navigate to the folder /home/pixel/uASIC/software/trunk and source the setup script env.sh. Make sure that control hub is running by running the start command: sudo /opt/cactus/bin/controlhub_start. To start up the hardware, connect the FPGA via ethernet cable to the computer, and make sure that the computer port IP is set to 192.168.200.1. Then turn on the FPGA and check (after a few seconds) that it responds by pinging it at 192.168.200.16.
The first test of the assembly should be to make sure there are no shorts on the PCB/bond wires. This is performed as follows:
The script will set the voltage regulator output and read back the voltages and currents. Check that the voltage is correctly set, and look at the currents. In general if these reach 100-200 mA then turn off the system quickly! If testing a system for the first time, look and record the current values on DACs 3, 4 and 5, saving the results in
.txt.
The next check is to make sure that there is no problem with the high voltage. In the lab there is a keithley which can be connected to the computer via ethernet cable. Check the IP on the keithley and put this value into the script iv.py. To perform the measurement:
The CCPDv3 sensor should show a sharp increase in current at 93 V, but in general should be lower than approximately 50 nA.
This is the first test to check the response of the CLICpix and to see that it is operational/usable. It consists of two steps: threshold equalisation of the pixel matrix and a threshold scan. This threshold scan can be used to determine the operating point of the device. To perform the test:
Now that the CLICpix is responding, the final check is that the HV-CMOS is also working. An indication of this should be given by the electrical tests above - the current consumption for DAC 3 should be of order 45 mA. Before taking any data, the operating threshold of the CLICpix must be determined. This can be done by looking at the threshold scan plots from the previous test - pick a value of the threshold for which the number of pixels responding is small (order 40-50). This should be approximately 120 DAC steps from the equalisation mean. Then:
Now the test should be performed again with a source on top of the HV-CMOS. Take the Sr90 source from the safe (remembering to display the source card next to the setup)
It is possible that on the first attempt the source will not be completely aligned with the sensor. In this case, repeat the measurement while moving the source until you find the maximum number of counts. Then take one set of data without moving the source further.
Bias voltages are applied to the p-wells and the substrate of CLICTD. There are two possibilities to apply the voltage:
Type |
Assembly |
Board ID |
Description |
Status |
Tests performed |
IV plot |
Threshold scan counts plot |
Threshold scan pixels plot |
Comments |
CCPDv3 |
SET9 |
001ec0db94b1 |
Ideal alignment |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam |
CCPDv3 |
SET10 |
001ec0db2e5e |
Quarter pixel misalignment |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam |
CCPDv3 |
SET11 |
001ec0dafabc |
Half pixel misalignment |
Unresponsive (?) in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Saw beam but doesn't show many hits |
CCPDv3 |
SET12 |
001ec0dbabb9 |
Ideal alignment, thicker glue |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam |
CCPDv3 |
SET13 |
001ec0db2082 |
Ideal alignment |
Alive in beam area |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Being tested in beam |
CCPDv3 |
SET14 |
001ec0db5bfb |
Half pixel misalignment |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam |
CCPDv3 |
SET15 |
001ec0db5ca6 |
Ideal alignment, thicker glue |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam |
CCPDv3 |
SET16 |
001ec0db5ca6 |
Half pixel misalignment |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
New sample, not tested in beam |
CLICTD |
A1 |
- |
Modified process with continuous n-type implant |
Alive in lab |
IV, Equalisation, Source and xray measurements |
- |
- |
- |
Tested in DESY testbeam, Wafer W5 |
CLICTD |
A2 |
- |
Modified process with continuous n-type implant |
Broken |
Equalisation, xray measurements |
- |
- |
- |
Wafer W5 |
CLICTD |
A3 |
- |
Modified process with continuous n-type implant |
Broken |
- |
- |
- |
- |
Wafer W5 |
CLICTD |
A4 |
- |
Modified process with continuous n-type implant |
Alive in lab |
Equalisation |
- |
- |
- |
Wafer W5, PCB with cut-out, Tested in DESY testbeam |
CLICTD |
A5 |
- |
Modified process with continuous n-type implant |
Broken |
- |
- |
- |
Equalisation, IV |
Wafer W5, thinned down to 100 um |
CLICTD |
A6 |
- |
Modified process with continuous n-type implant |
Alive in lab |
- |
- |
- |
Equalisation, IV |
Wafer W5, thinned down to 50 um |
CLICTD |
A7 |
- |
Modified process with continuous n-type implant |
Alive in lab |
- |
- |
- |
Equalisation, IV |
Wafer W5, thinned down to 100 um |
CLICTD |
A8 |
- |
Modified process with continuous n-type implant |
Broken |
- |
- |
- |
IV |
Wafer W5, thinned down to 40 um |
CLICTD |
A9 |
- |
Modified process with continuous n-type implant |
Alive in lab |
- |
- |
- |
IV, Equalisation |
Wafer W5, thinned down to 40 um, Bias only until -3.8 at p-wells |
CLICTD |
A10 |
- |
Modified process with continuous n-type implant |
Alive in lab |
- |
- |
- |
IV, Equalisation |
Wafer W5, thinned down to 40 um |
CLICTD |
B1 |
- |
Modified process with gap in n-type implant |
Broken |
IV, Equalisation, Source and xray measurements |
- |
- |
- |
Tested in DESY testbeam, Wafer W4 |
CLICTD |
B2 |
- |
Modified process with gap in n-type implant |
Alive in lab |
Equalisation, xray measurements |
- |
- |
- |
Wafer W4 |
CLICTD |
B3 |
- |
Modified process with gap in n-type implant |
Broken |
- |
- |
- |
- |
Wafer W4 |
CLICTD |
B4 |
- |
Modified process with gap in n-type implant |
Alive in lab |
Equalisation |
- |
- |
Equalisation |
Wafer W4, Tested in DESY testbeam, PCB with cut-out |
CLICTD |
B5 |
- |
Modified process with gap in n-type implant |
Alive in lab |
- |
- |
- |
Equalisation,IV |
Wafer W4, thinned down to 100 um |
CLICTD |
B6 |
- |
Modified process with gap in n-type implant |
Alive in lab |
- |
- |
- |
Equalisation,IV |
Wafer W4, thinned down to 50 um |
CLICTD |
B7 |
- |
Modified process with gap in n-type implant |
Alive in lab |
- |
- |
- |
Equalisation,IV |
Wafer W4, thinned down to 50 um |
CLICTD |
B9 |
- |
Modified process with gap in n-type implant |
Alive in lab |
- |
- |
- |
IV, Equalisation |
Wafer W4, thinned down to 40 um, one row not responsive |
CLICTD |
B10 |
- |
Modified process with gap in n-type implant |
Alive in lab |
- |
- |
- |
IV, Equalisation |
Wafer W4, thinned down to 40 um |
CLICTD |
W18_1 |
- |
Cz / high dose / extra p-well |
Alive in lab |
- |
- |
- |
IV, Equalisation |
Wafer W18, thickness 100 um |
CLICTD |
W15_1 |
- |
Cz / intermediate dose / gap |
physically damaged / scratch |
- |
- |
- |
IV |
Wafer W15, thickness 100 um |
CLICTD |
W8_1 |
- |
Epi / low dose / extra p-well |
IV good, no configuration |
- |
- |
- |
IV |
Wafer W8, thickness ??? um |
CLICpix+planar |
43 W |
001ec0da56b4 |
worst planar sensor |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam, many pixels show no hits during equalisation |
CLICpix+planar |
14 ok |
001ec0da4e0d |
ok planar sensor |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Not tested in beam, cannot take voltage anymore, 16 pixels show no hits during equalisation |
CLICpix+planar |
31 best |
001ec0da578c |
best planar sensor |
Alive in lab |
Electrical, IV, CLICpix |
IV curve |
Threshold scan |
Threshold scan |
Tested in beam, 9 pixels show no hits during equalisation |
CLICpix+planar |
50um-4 |
001ec0dacbb6 |
Active edge 50um thick |
Alive in lab |
Electrical, IV, CLICpix |
IV Curve |
Threshold scan |
Threshold scan |
New sample, not tested in beam |
CLICpix+planar |
150um-6 |
001ec0dab10e |
Active edge 150um thick |
Alive in lab |
Electrical, IV, CLICpix |
IV Curve |
Threshold scan |
Threshold scan |
New sample, not tested in beam |
CLICpix2+planar |
11-FBK398-1 (assembly 14) |
|
FBK act. edge 130 um thick, n-in-p |
Alive, nominal threshold = 1250 , nominal bias = -60V, baseline from lab equalisation = 1200 , half of matrix unconnected |
equalised, TP, source meas., test-beam data taken at SPS |
IV Curve |
|
|
x-ray Pixel categorisation |
CLICpix2+planar |
9-ADV100-4 (assembly 9) |
|
Advacam act. edge 100 um thick, GR GND, n-in-p |
Alive, bonding problems found |
|
IV Curve |
|
|
x-ray |
CLICpix2+planar |
15-ADV150-9 (assembly 15) |
|
Advacam act. edge 150 um thick, GR GND, n-in-p |
Alive, bonding problems found |
|
IV Curve |
|
|
x-ray |
CLICpix2+planar |
3-FBK398-2 (assembly 16) |
|
FBK act. edge 130 um thick, n-in-p |
Alive, nominal threshold = 1190, nominal bias = -60V, baseline from lab equalisation = 1148 |
equalised, TP, source meas., test-beam data taken at SPS |
IV Curve |
|
|
x-ray Pixel categorisation |
CLICpix2+planar |
ADV-S5 (assembly 18) |
|
Advacam act. edge 100 um thick, no GR, Ni/Au UBM, n-in-p |
Unresponsive after bias applied, thought to be because of the ASIC damage |
|
IV Curve |
|
|
x-ray-0 x-ray-1 chipped corner of CLICpix2 |
CLICpix2+planar |
FBK398-3 (assembly 19) |
|
FBK act. edge 130 um thick, n-in-p |
Alive, nominal threshold = 1190, nominal bias = -60V, baseline from lab equalisation = 1111 |
equalised, TP, source meas., test-beam data taken at DESY |
IV Curve |
|
|
x-ray-0 x-ray-1 Pixel categorisation |
CLICpix2+planar |
FBK398-4 (assembly 20) |
|
FBK act. edge 130 um thick, n-in-p |
Alive, nominal threshold = 1290, nominal bias = -60V, baseline from lab equlaisation = 1243 |
equalised, TP, source meas., test-beam data taken at DESY |
IV Curve |
|
|
x-ray-0 x-ray-1 Pixel categorisation |
CLICpix2+planar |
ADV-S3 (assembly 21) |
|
Advacam 100 um thick, Ni/Au |
Alive in lab, nominal bias -50V, nominal threshold 1285, baseline in lab equalisation = 1184. Large short region discovered in centre and at one edge of the pixel matrix (see pixel categorisation plot). |
configured, IV scan, equalised, source measurement, TP measurement, categorisation |
IV CurveIV Curve (new) |
|
|
bumped ASIC x-ray Pixel categorisation |
CLICpix2+planar |
ADV-S2 (assembly 22) |
|
Advacam 50 um thick, Pt |
Can be configured but draws high current. Can be operated up to -1.8V before hitting current limit of 100uA. Operational voltage of -0.4V with 146 masked pixels for low noise at a threshold of 1335 (current ~20uA), baseline from lab equalisation = 1183. Could only be equlaised with no bias applied. Fragile. |
configured, equalised at 0V only, IV scan, test pulsing, response to source in noise level therefore cannot be seen. Going to DESY test beam. |
IV Curve (powered) IV Curve (unpowered) IV Curve (forward bias) |
|
|
bumped ASIC x-ray testpulse_pulsedhitmap testpulse_unexpectedhitmap |
CLICpix2+planar act.edge |
FBK-3826-C7-A5 |
|
FBK 130 um thick, active edge |
alive in lab |
operation up to ~60V (@~65-80uA), can be equalised, responds to Sr90 |
I/V curve (unpowered) |
|
|
|
CLICpix2+planar act.edge |
FBK-3826-C4-B4 |
|
FBK 130 um thick, active edge |
alive in lab |
operation up to ~80V (@~1uA), can be equalised |
I/V curve (unpowered) |
|
|
|
FASTPix |
W03-S1-1 |
- |
Not optimised flavour |
Alive in lab |
Test-Beam Data |
- |
- |
- |
Wafer W3 |
FASTPix |
W15-S1-1 |
- |
Optimised flavour with low-dose nx |
Alive in lab, very noisy |
Test-Beam Data |
- |
- |
- |
Wafer W15 |
FASTPix |
W15-S1-2 |
- |
Optimised flavour with low-dose nx |
??? |
??? |
- |
- |
- |
Wafer W15 |
FASTPix |
W15-S1-3 |
- |
Optimised flavour with low-dose nx |
??? |
??? |
- |
- |
- |
Wafer W15 |
FASTPix |
W18-S1-1 |
- |
Optimised flavour with high-dose nx |
Alive in lab |
Test-Beam Data |
- |
- |
- |
Wafer W18 |
FASTPix |
W18-S1-2 |
- |
Optimised flavour with high-dose nx |
??? |
??? |
- |
- |
- |
Wafer W18 |
FASTPix |
W18-S1-3 |
- |
Optimised flavour with high-dose nx |
??? |
??? |
- |
- |
- |
Wafer W18 |
FASTPix |
W18-S1-4 |
- |
Optimised flavour with high-dose nx |
??? |
??? |
- |
- |
- |
Wafer W18 |
FASTPix |
W18-S1-5 |
- |
Optimised flavour with high-dose nx |
??? |
??? |
- |
- |
- |
Wafer W18 |
DPTS |
???-40-1 |
- |
Chip #40 DPTS (base version) |
Alive in lab |
??? |
- |
- |
- |
|
DPTS |
???-40-2 |
- |
Chip #40 DPTS (base version) |
Alive in lab |
??? |
- |
- |
- |
|
DPTS |
???-45-1 |
- |
Chip #45 DPTS-X (change in the encoding to reduce charge sharing) |
Alive in lab |
??? |
- |
- |
- |
|
DPTS |
???-45-2 |
- |
Chip #45 DPTS-X (change in the encoding to reduce charge sharing) |
Alive in lab |
??? |
- |
- |
- |
|