Pixel detector hybridization and integration with Anisotropic Conductive Films

  • Speaker: Mateus Vicente (CERN)
  • Status: Accepted
  • Abstract: An alternative pixel-detector hybridization technology based on Anisotropic Conductive Films (ACF) is under development to replace the conventional fine-pitch flip-chip bump bonding. The new process takes advantage of the recent progress in industrial applications of ACF and is suitable for time- and cost-effective in-house processing of single devices. This new bonding technique developed can also be used for the integration of hybrid or monolithic detectors in modules, replacing wire bonding or solder bumping techniques. This contribution introduces the new ACF hybridization and integration technique, and shows the first test results from Timepix3 hybrid pixel assemblies and from the integration of ALPIDE monolithic pixel sensors to flex circuits.
  • slides: Trento_MVicente_ACF.pdf
  • ACF principle (animated gif): GIF_slide4.gif

-- DominikDannheim - 2021-03-01

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GIFgif GIF_slide4.gif r1 manage 6670.6 K 2021-03-01 - 18:14 DominikDannheim Slides and animated gif
PDFpdf Trento_MVicente_ACF.pdf r1 manage 6859.4 K 2021-03-01 - 18:14 DominikDannheim Slides and animated gif
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Topic revision: r1 - 2021-03-01 - DominikDannheim
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