1 TEC Module Materials

TEC_Hybrid4APV

short Description: TEC Hybrid Rings 3/4/5/7
Mass: 11.988g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 1.267 9.465 5.427 26.192
Simulation 1.330 9.013 5.699 27.507

Comments

Dimensions 65.2 x 30 mm^2 = 19.56 cm^2

MCVolume: 6.52 x 3.0 x 0.068 = 1.33008 cm^3

 Composition of the Hybrids taken from TOB layers 1-2

(1) Hybrid reviewed November 2006 - Central Hybrid (no kapton tail, which is in ICC* material definition, see below)
   see http://www.fynu.ucl.ac.be/he/cms/activities/tracker/FHITfiles/CCTPHybrides.pdf
   - Kapton: (25+25) um = 50 um = 0.0050 cm --> 0.075 cm^3
   - Copper: (18+12+18+18+18+12) um = 96 um = 0.0096 cm --> 0.144 cm^3
   - Solder Mask: 20 um = 0.0020 cm --> 0.030 cm^3
   - Glue: (50+50) um = 100 um thickness = 0.0100 cm --> 0.150 cm^3 
      [WAS (1) new FR4 hybrid
      Estimate: 300 mu FR4,
             3 x 25 mu Cu
             ~300 mu Kapton 
      -Pt-Au layer: tbd  ]
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 18 
    C: 2 x 1206 large ones
       (5 + 2*n_APV)  0402 size    -> 13
                 0402: (1 x 0.5 x 0.5) mm^3 = 0.25 mm^3 = 0.25 x 10^-3 cm^3
                 1206: (3 x 1.5 x 1.5) mm^3 = 6.75 mm^3 = 6.75 x 10^-3 cm^3
    APV25:     (7.1 x 8.1 x 0.3) mm^3 = 17.253 mm^3 = 0.017253 cm^3     4 per hybrid REVIEWED November 2006 OK
    PLL:       (4.0 x 4.0 x 0.3) mm^3 = 4.8 mm^3 = 0.0048 cm^3          1 per hybrid REVIEWED November 2006 OK
         (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/PauloMoreira/PLL25%20User%20Manua2.1.pdf)
    MUX:       (5.0 x 5.0 x 0.3) mm^3 = 7.5 mm^3 = 0.0075 cm^3          1 per hybrid REVIEWED November 2006 OK
         (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/LVDSMUX3_datasheet.pdf)
          [WAS PLL+MUX  : 2.0 x 7.1 x 0.3 mm^3     1 per hybrid ]
http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/manuals.htm
    DCU  :     (2.0 x 2.0 x 0.3) mm^3 = 1.2 mm^3 = 0.0012 cm^3          1 per hybrid REVIEWED November 2006 OK
         (see http://cmstrackercontrol.web.cern.ch/CMSTrackerControl/documents/Magazzu/DCUF_User_Manual_v3.0.pdf)
(3) Wire bonds
   http://cms.ct.infn.it/bonding/bondspec.htm
      Al, 1% Si, 25 um diameter, medium hardness
      tail length visible but short < 50 um
   1 wire bond: average of 4 mm length diameter 25 um + 1 tail =
         = { [ pi x (0.025/2)^2 ] mm^2 x 4 mm } + { [ pi x (0.025/2)^2 ] mm^2 x 0.050 mm } =
         = [1.963x10^-3 mm^3] + [0.0245x10^-3 mm^3] = 2.0x10^-3 mm^3 = 2.0x10^-6 cm^3 [99% Aluminium + 1% Silicon]
      PA bias line to sensor bias ring: 5 bonds
      PA to hybrid: nAPV x 128 bonds
      PA to sensor: nAPV x 128 bonds
   TOTAL: 2x128xnAPV+5 bonds = 1029 bonds

In the TEC we mix the ceramic support into the hybrid.
(4) Ceramic support
   Area from the technical drawings: 19.55 cm^2
   Volume: 19.55 x 0.0387 = 0.7566 cm^3

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Central Hybrid Kapton T_Kapton 7.50e-02 1.05e-01 1.00 ELE 39.76 74.61
Central Hybrid Copper Copper 1.44e-01 1.29e+00 1.00 ELE 12.86 134.90
Central Hybrid Solder Mask T_Kapton 3.00e-02 4.20e-02 1.00 ELE 39.76 74.61
Central Hybrid Glue Epoxy 1.50e-01 1.95e-01 1.00 ELE 41.08 70.38
Resistors Carbon 4.50e-03 1.02e-02 18.00 ELE 42.70 86.30
R metal SMD_metal 1.80e-03 1.84e-02 18.00 ELE 9.08 165.69
Small caps Alumina 3.25e-03 1.14e-02 13.00 ELE 26.58 96.34
C metal SMD_metal 1.30e-03 1.33e-02 13.00 ELE 9.08 165.69
Large caps Alumina 1.35e-02 4.75e-02 2.00 ELE 26.58 96.34
C metal large SMD_metal 2.00e-03 2.04e-02 2.00 ELE 9.08 165.69
APV25 Silicon 6.90e-02 1.61e-01 4.00 ELE 21.82 106.00
PLL Silicon 4.80e-03 1.12e-02 1.00 ELE 21.82 106.00
MUX Silicon 7.50e-03 1.75e-02 1.00 ELE 21.82 106.00
DCU Silicon 1.20e-03 2.80e-03 1.00 ELE 21.82 106.00
Wire bonds Aluminium 2.04e-03 5.50e-03 1029.00 ELE 24.01 106.40
Wire bonds Silicon 2.06e-05 4.80e-05 1029.00 ELE 21.82 106.00
Ceramic Support Ceramic 7.57e-01 3.00e+00 1.00 SUP 27.94 96.34

TEC_Hybrid6APV

short Description: TEC Hybrid Rings 1/2/5
Mass: 20.236g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 1.304 15.517 5.479 26.493
Simulation 1.330 15.214 5.588 27.020

Comments

Central Hybrid (no tail)
Components:  Resistors
Capacitors
Wire bonds
Support

o  Hybrid for TEC rings 1,2,5
Taken from TOB Layers 5-6

Hybrids have 6 APVs

as above, except: 
(2) Hybrid components
    R: (14 + n_APV)   0402 size  material: carbon   -> 20 
    C: 2 x 1206 large ones
       (5 + 2xn_APV)  0402 size    -> 17
(3) Wire bonds
   see above for details
   TOTAL: 2x128xnAPV+5 bonds = 1541 bonds

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Central Hybrid Kapton T_Kapton 7.50e-02 1.05e-01 1.00 ELE 39.76 74.61
Central Hybrid Copper Copper 1.44e-01 1.29e+00 1.00 ELE 12.86 134.90
Central Hybrid Solder Mask T_Kapton 3.00e-02 4.20e-02 1.00 ELE 39.76 74.61
Central Hybrid Glue Epoxy 1.50e-01 1.95e-01 1.00 ELE 41.08 70.38
Resistors Carbon 5.00e-03 1.13e-02 20.00 ELE 42.70 86.30
R metal SMD_metal 2.00e-03 2.04e-02 20.00 ELE 9.08 165.69
Small caps Alumina 4.25e-03 1.50e-02 17.00 ELE 26.58 96.34
C metal SMD_metal 1.70e-03 1.73e-02 17.00 ELE 9.08 165.69
Large caps Alumina 1.35e-02 4.75e-02 2.00 ELE 26.58 96.34
C metal large SMD_metal 2.00e-03 2.04e-02 2.00 ELE 9.08 165.69
APV25 Silicon 1.04e-01 2.41e-01 6.00 ELE 21.82 106.00
PLL Silicon 4.80e-03 1.12e-02 1.00 ELE 21.82 106.00
MUX Silicon 7.50e-03 1.75e-02 1.00 ELE 21.82 106.00
DCU Silicon 1.20e-03 2.80e-03 1.00 ELE 21.82 106.00
Wire bonds Aluminium 3.05e-03 8.24e-03 1541.00 ELE 24.01 106.40
Wire bonds Silicon 3.08e-05 7.18e-05 1541.00 ELE 21.82 106.00
Ceramic Support Ceramic 7.57e-01 3.00e+00 1.00 SUP 27.94 96.34

TEC_PitchAdapter

short Description: TEC pitch adapter
Mass: 1.699g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 1.110 1.531 12.257 72.951
Simulation 1.060 1.603 11.708 69.684

Comments

Central Hybrid (no tail)
Components:  Resistors
Capacitors
Wire bonds
Support


 Pitch adapter
  -> Using Volume/Area of the Ring5N PA!

(1) PA:
  Material Description from SCHOTT
  MC Area 16.01 cm^2 (from hetechnical drawings)
  MC Volume 16.01 x 0.0665 = 1.06 cm^3
(2)Spacer:
  Mixted into the PA
  correct Volume: 3.63 cm^2 x 0.0209 cm = 0.07588 cm^3

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Silicon Silicon 3.22e-01 7.50e-01 1.00 ELE 21.82 106.00
Sodium Sodium 4.78e-02 4.63e-02 1.00 ELE 27.97 99.52
Potassium Potassium 5.90e-02 5.07e-02 1.00 ELE 17.31 118.79
Zinc Zinc 4.77e-02 3.39e-01 1.00 ELE 12.43 141.01
Aluminium Aluminium 2.36e-02 6.36e-02 1.00 ELE 24.01 106.40
Titanium Titanium 2.54e-02 1.15e-01 1.00 ELE 16.13 124.62
Antimony Antimony 4.86e-03 3.25e-02 1.00 ELE 8.72 173.47
Chromium Chromium 1.00e-05 7.18e-05 1.00 ELE 14.94 130.63
Oxygen Oxygen 5.04e-01 7.20e-04 1.00 ELE 34.24 91.00
Spacer Ceramic 7.59e-02 3.01e-01 1.00 SUP 27.94 96.34

TEC_frame_side_1_4

short Description: TEC frame legs 1 to 4
Mass: 3.881g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 1.862 2.084 19.287 40.663
Simulation 1.862 2.084 19.287 40.662

Comments

Not in the material right now!
 11 "Boron"           "Boron"                0.02601   1  ELE


o Module frame legs Rings 1 to 4
  Using Data from R3N

  Note:
  The Side Frames are constructed after the iso-side. Additional material on the bias side isa
  added via the supportboxes and the tail (in petals)
  MC Area: 18.22 cm^2
  MC Volume: 18.22 x 0.1022 = 1.862 cm^3
  (1) Carbon  frame 
     Volume 18.22 x 0.0764 = 1.392 cm^3
  ISO-Kapton
  Volume 18.22 x 0.0258 = 0.470 cm^3
  This devides into:
  (2)  Copper traces 2.3925 x 0.0035 = 0.00837 cm^3
  (3)  Gold  1.99414 x 0.00001 = 0.00002 cm^3
  (4)  Nickel 1.9941 x 0.0004 = 0.0008 cm^3
  (5) rest -> kapton : 0.4608 cm^3
  silver glue and components are neglected due to missing measurements

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Carbon frame Carbon 1.39e+00 3.15e+00 1.00 SUP 42.70 86.30
Copper traces Copper 8.40e-03 7.53e-02 1.00 ELE 12.86 134.90
Gold Gold 2.00e-05 3.77e-04 1.00 ELE 6.46 203.64
Nickel Nickel 8.00e-04 7.10e-03 1.00 ELE 12.68 136.02
LV Kapton T_Kapton 4.61e-01 6.45e-01 1.00 ELE 39.76 74.61

TEC_frame_side_5_7

short Description: TEC frame legs 5 to 7
Mass: 6.103g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 3.703 1.648 24.415 46.655
Simulation 3.296 1.851 21.731 41.527

Comments


o Module frame legs Rings 5 to 7
  Using Data from R7N

  Note:
  The Side Frames are constructed after the iso-side. Additional material on the bias side isa
  added via the supportboxes and the tail (in petals)
  MC Area: 32.25 cm^2
  MC Volume: 32.25 x 0.1022 = 3.296 cm^3
  (1) Carbon  frame 
     Volume (32.25+5.33) x 0.0764 = 2.871 cm^3
  ISO-Kapton
  Volume 32.25 x 0.0258 = 0.832 cm^3
  This devides into:
  (2)  Copper 3.03469 x 0.0035  = 0.01062 cm^3
  (3)  Gold   1.70505 x 0.00001 = 0.00002 cm^3
  (4)  Nickel 1.7051  x 0.0004  = 0.00068 cm^3
  (5) rest -> kapton : 0.82068  cm^3
  silver glue and components are neglected due to missing measurements

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Carbon fiber frame Carbon fibre str. 2.87e+00 4.85e+00 1.00 SUP 42.25 76.75
Copper traces Copper 1.06e-02 9.52e-02 1.00 ELE 12.86 134.90
Gold Gold 2.00e-05 3.77e-04 1.00 ELE 6.46 203.64
Nickel Nickel 6.80e-04 6.04e-03 1.00 ELE 12.68 136.02
LV Kapton T_Kapton 8.21e-01 1.15e+00 1.00 ELE 39.76 74.61

TEC_SideFrSupBox

short Description: TEC Sideframe Supplies Box
Mass: 0.350g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 0.135 2.597 5.855 39.775
Simulation 0.123 2.848 5.337 36.261

Comments




o Supplies Boxes
  Usind data from R3N
  MC Area:   4.78 cm^2
  MC Volume: 4.78 x 0.0258 = 0.123 cm^3
  (1 to 3) from kaptonaufteilung.ods  by minimizing the standarad diviation which is still 18.8%
  (4) rest 
  (5) from silver glue 12.5 mg / 1049 mg/cm^3 = 0.01191

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Copper traces Copper 6.39e-03 5.73e-02 1.00 ELE 12.86 134.90
Gold Gold 2.00e-05 3.77e-04 1.00 ELE 6.46 203.64
Nickel Nickel 6.10e-04 5.41e-03 1.00 ELE 12.68 136.02
LV Kapton T_Kapton 1.16e-01 1.62e-01 1.00 ELE 39.76 74.61
Silver Silver 1.19e-02 1.25e-01 1.00 ELE 8.91 166.61

TEC_SiReenforcment

short Description: SiReenforcment
Mass: 5.139g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 1.296 3.965 7.046 24.297
Simulation 1.296 3.965 7.046 24.297

Comments


o Si-Reinforcement
  using Data from R1N
  MC Area: 3.35 cm^2
  MC Volume: 3.35 x 0.387 = 1.296 cm^3

  Is made out of ceramic

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
Ceramic Ceramic 1.30e+00 5.14e+00 1.00 SUP 27.94 96.34

TEC_frame_top

short Description: TEC module frame top
Mass: 0.758g
Volume Density X0 λ0
cms3 g cm-3 cm cm
Real 0.335 2.265 18.850 38.102
Simulation 0.372 2.038 20.944 42.336

Comments




o TEC frame at the module top

  Note: This was changed directly in tecmaterials.xml specifics are coming soon.
  MC Volume: Width of the module x 3.72 x 0.1 cm
  Actual volume is about that minus 10 %

  (1)  Carbon

   Numbers for unit width of module !

Material

Description Material Name Volume Mass Count Type X0 λ0
cm3 g g cm-2 g cm-2
TEC frame top Carbon 3.35e-01 7.58e-01 1.00 SUP 42.70 86.30

-- MatthiasEdelhoff - 03 Jul 2008

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