RICH 1 Upgrade Services
This is a rough guess at the number of services required for RICH 1.
DO NOT TAKE FOR GRANTED
RICH 1 Services
Mostly taken from a
talk
at the infrastructure workshop. but based on a plane of 11 columns, a column of 6 modules, and a module of 2 DB and 4 ECs.
Data
Each DB requires a fibre per GBT, there are two GBTs per FPGA, and 3 FPGAs per board. Each DB is coupled to a harness board which merge fibres into ribbons. Each ribbon will remain as a bundle all the way to the TELL40s, so should only contain data. It is envisioned that a 12 fibre ribbon can cover two digital boards, and hence a single module. Patch panel connectors like one of these
http://www.usconec.com/products/mtp_adaptors.htm
, probably.
ECS
Each DB requres a transmission and receiver fibre coupled through a GBT to the SCA. It is envisioned that a 12 fibre ribbon will serve multiple boards. The ribbons will go all the way to a SOL40, presumably there are no PCIe40s configured for data, ECS, and TFC. Same patch panel connectors as Data.
Low Voltage
LV shared across a column. 8.5 Amps per DB, so 100 A per column, probably at 2.5/5 V? quick back of envelope calc says conductors ~ 7mm diameter (20 m ~ 1V drop). Need, both positive and ground connections.
High Voltage
1.1kV, mostly common to a module, some split powering in high occupancy regions (a 4 by 4 module region) of the last, and maybe last but one dynode. Maybe some SHV connector like
http://www.alliedelec.com/1/products/106825-0-187-gold-solder-nickel-shv-connector.html
, since it's only 1kV? Arrives at the detector as several 56 conductor cables 04.31.52.100.5(cern stores), needs to get to the harness as 1 or 2 or 3 SHVs?. Common ground on a column (or to several modules), so patch panel isn't straight through. Will need a patch panel to cover the plane/several columns rather than per column.
Cooling
Externally, same as now, two loops (one for the up box, one for down box), but beefed up a bit. Internally a cooling bar, with coolant tubes built in. between the two there has to be some manifold, as daisy chaining is probably a bit too much, but the specifics is all provisional.
DSS/DCS
Most of the monitoring of the detector will come through the SCA, however there will need to be some thermometery inside the enclosure (4-5 sensors?), probably a thermoswitch per column, but maybe per module, some humidity sensors? Potentially the voltage of each DC/DC converter needs to be measured, so 8 per module, 48 per column.
If we assume 6 thermoswitches and 48 voltages per column, we have 108 wires to take out per column, can we reduce this? Additionally we can assume about 30 for thermometry and misc environmental sensors spread through the whole box.
Calibration
Probably going to have some fibres to inject a laser, 1 x 12 MPO per box like we currently have?
Spares
Should probably have some. 1 spare data, 1 spare ECS 12 MPO per column?
Summary
Some very incomplete summary tables for different levels.
Per module
Service |
Number |
Type |
Comment |
Data |
1 |
12 fibre MPO |
Some how shared between the two boards |
ECS |
4 |
Individual fibres |
How will they enter the module? |
LV |
1 |
Pair of 3mm plugs? |
That's how it's connected internally now. |
HV |
1 (+1/2 if split powered?) + 1 gound |
SHV? |
Common ground. |
Cooling |
1 |
cooling bar |
All modules connected to a common heat sink |
DSS/DCS |
8 + 1 |
TWP? |
Do we need measure every voltage? Granularity of the thermoswitches? |
Per column
Service |
Number |
Type |
Comment |
Data |
6 |
12 fibre MPO |
One per module |
ECS |
2 |
12 fibre MPO |
Shared between multiple modules |
LV |
1 |
Pair of screw terminal again? |
|
HV |
6 ( + 4/8 if split powered) + 3/6? ground |
SHV? |
Rather speculative |
Cooling |
2 |
quick release? |
Assume similar to current RICH 1, in and out |
DSS/DCS |
48 + 6 |
TWP? |
Do we need measure every voltage? Granularity of the thermoswitches? |
Per plane
Service |
Number |
Type |
Comment |
Data |
66 |
12 fibre MPO |
No spares |
ECS |
22 |
12 fibre MPO |
No spares |
LV |
11 |
Pairs of scew terminals? |
One per column |
HV |
66 + 16/32 (split powering) + ~20 ground |
SHV? |
Ground shared at patch panel, probably. Arrives at patch panel as 56 conductor cables |
Cooling |
2 |
cooling loop in and out |
Assumes some manifold somehere. |
DSS/DCS |
~600 |
TWP? |
Really? |
Territorial guess
The cross-secional area of a column is

, so as a first guess we'll say this is the space for per column services.
First guess, no HV or cooling.
For the HV: Assume split poweing of last and second to last dynode + 2 spare channels = 100 so 10x10 SHV array (internal). The inside is the setting the limits, the 56 conductor cables. SHV connector ~ 15mm + 10 mm finger room -> 260mmx260mm patch panel. Would need t be quite thick though.
Internal cabling
An attempt to produce a summary of all the known services from the patch panel to the digital boards.
Red = Very rough guess.
Blue = Provisional.