1) Internal discussion with Hamamatsu CH 4.July 2013, new detector 128CH with CB-02 trench technology under way. Samples can be expected by the end of the year. Several questions should be answered in the process of finalizing this:

a) pulse shape (faster tau_1, slower tau_2) (towards Ketek pulses

b) size of detector (6 fiber layers or 5)

See presentation:

2) New flex PCB is ready for production, we will order 20pce and assembly some with detectors. The expeced date of first flex modules is 31.July 2013

(find the dimensions in the step file, and a view of the PCB attached here)

Temperature sensor NTP or PT1000 pad forseen

Note: We have kept the same connectors as on the present flex, this allows for easy attachement to the present electronics.

3) The attenuator with the Beetle is under test, for the Ketek and the Hamamatsu detectors pulse shape scans were done and we are bonding a new circuit with small amount of identical channels. PCB will be layouted and produced during the next 6-7weeks (holidays and production time). Working hardware expected in about 2 month from now. 4 channel Beetle board.

4) Step files and some pdf views of the new double layer modules available. They are called BGV modules and will give some complementary info to the prototype modules with monolayer.

Step files abailable at:

• flex_all.pdf: Flex pcb v2

• hamamatsu_50um_test_june_2013.pdf: Internal discussion with Hamamatsu

• BGV_all.pdf: All pdf for BGV modules