Acreo Capabilities

Silicon Technology

Complete line for fabrication of Silicon MOS devices for special applications like
  • sensors
  • nano-device research or material development

Key equipment

  • Si/SiGe epitaxy tool
  • Stepper lithography
  • Rapid Thermal Annealing and state of the art multi chamber tool for etching of poly-Si, dielectrics and metals.

MEMS Technology

Fabrication resources for both surface and bulk micro-machining in Silicon, quartz and glass.

Key equipment

  • Wafer bonder
  • Mask aligner for contact lithography and RIE tools for deep etching of Si and SiO2.

Post Processing

Enables further steps towards system construction. Devices fabricated and tested on wafer level can be separately mounted as parts of the systems.

Key equipment

  • dice saws
  • wafer cleaving tool
  • wire bonders
  • flipchip bonder

Measurement Laboratories

Electrum Laboratory offers a very wide spectrum of analytical equipment for both material characterizations and electrical measurement of components.

Examples of available analytical methods

  • microscopy (optical, SEM and AFM)
  • spectroscopy (SIMS) or diffraction (XRD)
For electrical characterization of components on wafer level automatic probes stations are available together with different apparatus for both DC and high frequency measurements.

-- SotirisFragkiskos - 05-Sep-2011


This topic: Main > TWikiUsers > SotirisFragkiskos > SiliconSensorCompaniesInstitutes > AcreoCap
Topic revision: r2 - 2011-09-05 - SotirisFragkiskos
 
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