TWiki> Main Web>SiliconSensorAlliance>AcreoCap (revision 1)EditAttachPDF

Acreo Capabilities

Silicon Technology

Complete line for fabrication of Silicon MOS devices for special applications like
  • sensors
  • nano-device research or material development

Key equipment

  • Si/SiGe epitaxy tool
  • Stepper lithography
  • Rapid Thermal Annealing and state of the art multi chamber tool for etching of poly-Si, dielectrics and metals.

MEMS Technology

Fabrication resources for both surface and bulk micro-machining in Silicon, quartz and glass.

Key equipment

  • Wafer bonder
  • Mask aligner for contact lithography and RIE tools for deep etching of Si and SiO2.

Post Processing

Enables further steps towards system construction. Devices fabricated and tested on wafer level can be separately mounted as parts of the systems.

Key equipment

  • dice saws
  • wafer cleaving tool
  • wire bonders
  • flipchip bonder

Measurement Laboratories

Electrum Laboratory offers a very wide spectrum of analytical equipment for both material characterizations and electrical measurement of components.

Examples of available analytical methods

  • microscopy (optical, SEM and AFM)
  • spectroscopy (SIMS) or diffraction (XRD)
For electrical characterization of components on wafer level automatic probes stations are available together with different apparatus for both DC and high frequency measurements.

-- SotirisFragkiskos - 05-Sep-2011

Edit | Attach | Watch | Print version | History: r2 < r1 | Backlinks | Raw View | Raw edit | More topic actions...
Topic revision: r1 - 2011-09-05 - SotirisFragkiskos
    • Cern Search Icon Cern Search
    • TWiki Search Icon TWiki Search
    • Google Search Icon Google Search

    Main All webs login

This site is powered by the TWiki collaboration platform Powered by PerlCopyright & 2008-2020 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
Ideas, requests, problems regarding TWiki? Send feedback