This is a test page for HGCALModuleAssembly
This page will contain documentation and procedures for assembling modules for the High-Granularity Calorimeter (HGCal).
FAQ HGCALModuleAssemblyFAQ
Q&A HGCALModuleAssemblyQNA
Page Contents
Page Contents
Assembly steps
Kapton application
Sensor application
PCB application
Wirebonding and Encapsulation
Storage and Handling
Modules
Top layer Sensor
Top layer PCB, not bonded
Top layer PCB, bonded, not encapsulated
Top layer PCB, bonded, encapsulated
Sensors
PCBs
Shipping and receiving
Shipping
Receiving
-- BrunelConstantineOdegard - 2019-02-22
Edit | Attach | Topic revision: r2 - 2019-02-25 - BrunelConstantineOdegard
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