This is a test page for HGCALModuleAssembly This page will contain documentation and procedures for assembling modules for the High-Granularity Calorimeter (HGCal). FAQ HGCALModuleAssemblyFAQ Q&A HGCALModuleAssemblyQNA --- Page Contents %TOC% --- ---+ Assembly steps ---++ Kapton application ---++ Sensor application ---++ PCB application ---++ Wirebonding and Encapsulation ---+ Storage and Handling ---++ Modules ---+++ Top layer Sensor ---+++ Top layer PCB, not bonded ---+++ Top layer PCB, bonded, not encapsulated ---+++ Top layer PCB, bonded, encapsulated ---++ Sensors ---++ PCBs ---+ Shipping and receiving ---++ Shipping ---++ Receiving -- Main.BrunelConstantineOdegard - 2019-02-22
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Topic revision: r2 - 2019-02-25
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BrunelConstantineOdegard
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