This is a test page for HGCALModuleAssembly

This page will contain documentation and procedures for assembling modules.

FAQ HGCALModuleAssemblyFAQ

Q&A HGCALModuleAssemblyQNA

Assembly steps

Kapton application

Sensor application

PCB application

Wirebonding and Encapsulation

Storage and Handling


Top layer Sensor

Top layer PCB, not bonded

Top layer PCB, bonded, not encapsulated

Top layer PCB, bonded, encapsulated



Shipping and receiving



-- BrunelConstantineOdegard - 2019-02-22

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Topic revision: r1 - 2019-02-22 - BrunelConstantineOdegard
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