This is a test page for HGCALModuleAssembly

This page will contain documentation and procedures for assembling modules.

FAQ HGCALModuleAssemblyFAQ

Q&A HGCALModuleAssemblyQNA

Assembly steps

Kapton application

Sensor application

PCB application

Wirebonding and Encapsulation

Storage and Handling

Modules

Top layer Sensor

Top layer PCB, not bonded

Top layer PCB, bonded, not encapsulated

Top layer PCB, bonded, encapsulated

Sensors

PCBs

Shipping and receiving

Shipping

Receiving

-- BrunelConstantineOdegard - 2019-02-22

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Topic revision: r1 - 2019-02-22 - BrunelConstantineOdegard
 
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