VFAT3bPackageTwiki < Sandbox

-- Main.FrancescoLicciulli - 2019-09-24

---+!! *VFAT3 Packaged*
This page contains all the technical data and information about the design and the test of the packaged version of the VFAT3 chip.

---++ *Organizzations Involved*
<ul> 
<li>INFN - Sezione di Bari: technical management and testing,</li>
<li>IMEC: design, simulations and production.</li>
</ul>


---++ *VFAT3 Package Design & Production*
Design, simulations and production of the package has been assigned to IMEC (https://www.imec-int.com/en/iclink) by means of a public price enquiry. The VFAT3 packaging process has been organized into three main steps:
<ol>
<li>Package substrate design and simulations.</li>
<li>Prototypes production.</li>
<li>Series production.</li>
</ol>

Regarding to the first step IMEC will provide:
<ul>
<li> Design files of the package design compatible with Cadence Allegro Package Designer (.mcm),</li>
<li> An electrical analysis report including the characteristic impedance of the high-speed nets,</li>
<li> A thermal analysis report of the package,</li>
<li> Design guidelines for the PCB.</li>
</ul>

---++ *Package General Description*
VFAT3 will be enclosed in a Ball Grid Array (BGA) package with the following specifications:
<ul>
<li>Ball Grid Array: 20 x 20 array,</li>
<li>Ball Grid Array Pitch: 0.8 mm,</li>
<li>Package size: 17 mm x 17 mm, </li>
<li>Package material: organic, </li>
<li>Number of layers of the substrate: 4,</li>
<li>Thickness of complete assembly at its thickest point: <= 1.6 mm.</li>
</ul>

---++ *Technical Documents*
|*File*|*Note*|
| [[%ATTACHURL%/VFAT3b_package_outline.pdf][VFAT3b_package_outline.pdf]]: VFAT3b_package_outline.pdf |physical dimensions of the package|
| [[%ATTACHURL%/VFAT3b_prot_ballout.xlsx][VFAT3b_prot_ballout.xlsx]]: VFAT3b_prot_ballout.xlsx |Package pin assignement|
| [[%ATTACHURL%/VFAT3b_prot_electric_diagram.pdf][VFAT3b_prot_electric_diagram.pdf]]: VFAT3b_prot_electric_diagram.pdf |Electrical diagram of the substrate|

---++ *Substrate Design File*
|*File*|*Note*|
| [[%ATTACHURL%/ISE_EU_IM2163_20190924.mcm][ISE_EU_IM2163_20190924.mcm]]: ISE_EU_IM2163_20190924.mcm | Cadende Allegro design file of the package substrate|
</br>
For the users that do not use Cadence tools, in order to view the layout of the package substrate Cadence provides a free viewer called "Allegro/OrCAD/SIP/MCM FREE Physical Viewers" that can be downloaded from this link https://www.cadence.com/content/cadence-www/global/en_US/home/tools/allegro-downloads-start.html.

Attachments

Topic attachments
I	Attachment	History	Action	Size	Date	Who
mcm	ISE_EU_IM2163_20190924.mcm	r1	manage	4236.6 K	2019-09-24 - 17:08	FrancescoLicciulli
pdf	VFAT3b_package_outline.pdf	r1	manage	78.4 K	2019-09-24 - 17:08	FrancescoLicciulli
xlsx	VFAT3b_prot_ballout.xlsx	r1	manage	17.7 K	2019-09-24 - 17:08	FrancescoLicciulli
pdf	VFAT3b_prot_electric_diagram.pdf	r1	manage	128.7 K	2019-09-24 - 17:08	FrancescoLicciulli

Topic revision: r1 - 2019-09-24 - FrancescoLicciulli

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