This page contains information on the wire-bond testing program. This test will check if wire bonds are correctly bonded from the chip to the sensor. The normal running mode is just to check for connected bonds. There is also an additional mode where the test can be run to test for shorted bonds, however this is currently experimental (2019-11-08).


The program is loaded by ITSDAQ by default.


Hello world, this is a new topic!

This links to WebSearch.


-- WilliamJamesFawcett - 2019-11-08

Edit | Attach | Watch | Print version | History: r1 | Backlinks | Raw View | WYSIWYG | More topic actions
Topic revision: r1 - 2019-11-08 - WilliamJamesFawcett
    • Cern Search Icon Cern Search
    • TWiki Search Icon TWiki Search
    • Google Search Icon Google Search

    Sandbox All webs login

This site is powered by the TWiki collaboration platform Powered by PerlCopyright & 2008-2023 by the contributing authors. All material on this collaboration platform is the property of the contributing authors.
or Ideas, requests, problems regarding TWiki? use Discourse or Send feedback